Deploying Next-Generation Optical Communication Technology: UMC Partners with Harvard Startup for Mass Production of TFLN Platform
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格隆汇 March 12｜The wafer foundry announced on Thursday that it has established a manufacturing partnership with HyperLight, a startup from Harvard University's Nano-Optics Laboratory, to accelerate mass production of HyperLight's TFLN Chiplet (thin-film lithium niobate chip) platform. This material is regarded as a core technology for next-generation optical interconnects, enabling higher bandwidth and lower power consumption, with targeted applications in high-speed communications for AI data centers.
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